Hangzhou Xinyanke Semiconductor Material Co., LTD
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Silicon carbide reduced grinding wheel (1)
Silicon carbide reduced grinding wheel (2)
Ultra-thin cutting wheel for chip packaging
Monocrystalline silicon double end grinding wheel
Monocrystalline silicon wafer thinning wheel
Chamfered grinding wheels for the semiconductor in
CMP polishing pad trim tray
Double-sided grinding wheel dressing wheel
Chamfered wheel dresser
Grinding wheels for the semiconductor industry
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Product center
Semiconductor industry
Trimming tool
Chamfered grinding wheels for the semiconductor industry
Grinding wheels for the semiconductor industry
Monocrystalline silicon wafer thinning wheel
Monocrystalline silicon double end grinding wheel
Silicon carbide reduced grinding wheel (2)
Silicon carbide reduced grinding wheel (1)
CMP polishing pad trim tray
Chamfered wheel dresser
Double-sided grinding wheel dressing wheel
Ultra-thin cutting wheel for chip packaging
General Shi： 13137704933 Mr. Wang ：19357190285 Contact email: shidongli@dxinyan.com / wangquankui@dxinyan.com Contact number: 0571-86129869 Address: 1F, Building 1, No. 516, Shunfeng Road, Linping Street, Linping District, Hangzhou
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