100+
case
1000+
client
300+
Awards
100+
patent
ABOUT US
ABOUT US
Hangzhou Xinyan Semiconductor Materials Co., Ltd. is a scientific and technological enterprise specializing in the research and development and production of precision tools for semiconductor wafer processing. It was founded by the semiconductor research and development management team of Zhengzhou Bolisen New Material Technology Co., LTD.
Burleson Semiconductor team concentrated on the development of monocrystal silicon and silicon carbide wafer with two series of a total of six models of ultra-precision ultra-hard material abrasive tools and matching dressing tools, obtained 19 core patents, some products successfully replaced imports. In order to meet the requirements of high specification quality control of semiconductor industry products and better serve the needs of cutting grinding and polishing of semiconductor industry, in July 2023, Hangzhou Core Research Institute was created in Linping, Hangzhou, specializing in the development and production of professional grinding wheels for the semiconductor industry.
Hangzhou Core Research has an industry's top superhard abrasive technology team, there are 3 academic leaders, equipped with inorganic, metal materials, polymer materials, abrasives, grinding technology and other professional technical personnel, and equipped with domestic first-class test and production equipment, covers an area of 5,000 square meters, with 30,000 pieces of superhard abrasive production capacity. For the semiconductor industry grinding and polishing technology first-class comprehensive service provider.
NEWS CENTER
NEWS CENTER
General Shi： 13137704933 Mr. Wang ：19357190285
Contact email: shidongli@dxinyan.com / wangquankui@dxinyan.com
Contact number: 0571-86129869
Address: 1F, Building 1, No. 516, Shunfeng Road, Linping Street, Linping District, Hangzhou
Scan code attention
Scan code attention