Hangzhou Xinyanke Semiconductor Material Co., LTD
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Silicon carbide reduced grinding wheel (1)
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Ultra-thin cutting wheel for chip packaging
Monocrystalline silicon double end grinding wheel
Monocrystalline silicon wafer thinning wheel
Chamfered grinding wheels for the semiconductor in
CMP polishing pad trim tray
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Grinding wheels for the semiconductor industry
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Silicon carbide reduced grinding wheel (1)
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Code
006
Series
Grinding wheel
Spec
Country IV
Material
Stainless steel
Color
silver
Model
X
13800000000
Detail
General Shi: 13137704933 Mr. Wang :19357190285 Contact email: shidongli@dxinyan.com / wangquankui@dxinyan.com Contact number: 0571-86129869 Address: 1F, Building 1, No. 516, Shunfeng Road, Linping Street, Linping District, Hangzhou
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