Ultra-thin cutting wheel for chip packaging

The integral ultra-thin cutting wheel is mainly used for cutting and grooving various electronic components and precision parts in the electronic information field and the mechanical industry, such as semiconductor packaging materials, optical glass, quartz glass, precision ceramics, magnetic materials and so on.

The binder is elastic, which can effectively prevent mouth collapse and improve the yield. High processing efficiency, long service life; Cutting sharp can effectively reduce the number of grinding wheel dressing or no dressing; High cutting precision, wide range of application.

Specifications and models:

                    Type 1A8 has a diameter of 50-100mm and a thickness of 0.15-0.5mm