Hangzhou Xinyanke Semiconductor Material Co., LTD

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    • Silicon carbide reduced grinding wheel (1)
    • Silicon carbide reduced grinding wheel (2)
    • Ultra-thin cutting wheel for chip packaging
    • Monocrystalline silicon double end grinding wheel
    • Monocrystalline silicon wafer thinning wheel
    • Chamfered grinding wheels for the semiconductor in
    • CMP polishing pad trim tray
    • Double-sided grinding wheel dressing wheel
    • Chamfered wheel dresser
    • Grinding wheels for the semiconductor industry
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Condition:
Chamfered grinding wheels for the semiconductor industry
Chamfered wheel dresser
CMP polishing pad trim tray
Double-sided grinding wheel dressing wheel
Grinding wheels for the semiconductor industry
Monocrystalline silicon double end grinding wheel
Monocrystalline silicon wafer thinning wheel
Silicon carbide reduced grinding wheel (1)
Silicon carbide reduced grinding wheel (2)
Ultra-thin cutting wheel for chip packaging
1
General Shi: 13137704933 Mr. Wang :19357190285 Contact email: shidongli@dxinyan.com / wangquankui@dxinyan.com Contact number: 0571-86129869 Address: 1F, Building 1, No. 516, Shunfeng Road, Linping Street, Linping District, Hangzhou
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